On the 200mm line, drying after cleaning isn’t just downtime. It’s where surface tension, leftover solvent, and micro-contamination decide whether the next photoresist coat lands within spec—or quietly folds in lithography. What actually matters under the hood Our 200mm wafer drying module is built around a thermal profile that’s repeatable by design. The hot zone holds ±0.1°C uniformity across the wafer plane, so soft bake and hard bake temperatures translate straight into consistent photoresist behavior. The chamber and gas path are compatible with cleanroom Class 1–100, and the system is built to deliver zero particle events once it’s running steady. We call it out the way we measure it: same temperature, same ramp rate, cycle after cycle. Why it behaves like this on the floor In practice, that thermal discipline cuts down line-of-sight defects that start as water marks and end as yield loss. Tighter temperature control shrinks the drying window without cutting corners, which keeps throughput up and keeps the thermal budget inside what the photoresist can tolerate. The payoff is fewer excursions, less scrap, and a wafer that’s truly dry for the next critical step—without adding contamination risk. What you need to plan for The module drops into existing 200mm process tools, but the exhaust abatement and gas supply have to match the site’s pressure and flow tolerances. Expect a commissioning window to tune the bake profile to your exact photoresist stack. Once it’s dialed in, uptime is solid, but that initial setup time is real—plan it up front, and you’ll get it back in stable yield.